Atmel Introduces Stack Die Capability for its FPGA Conversion Product Offering; First Customer Achieves Large Savings

NANTES, France--(BUSINESS WIRE)--Jan. 21, 2003--Atmel(R) Corporation (Nasdaq:ATML) announced today the first conversion of an FPGA into an Atmel ULC, with a stacked parallel EEPROM, conveniently housed in a single ChipArray(R) Thin Core Ball Grid Array (CTBGA) package.

Atmel's FPGA conversion design flow has been improved to handle stacked dice. Now, Atmel can house external memory used along with any FPGA or ASIC into a single ULC package. Using fully probed dice eases the test approach, and guarantees the best coverage at the final test stage, without compromising quality.

Elan Digital Systems, world leaders in high speed serial/PCMCIA interface ICs, were looking for board size reduction and additional integration, to fulfill the ever increasing demand for small form factor modules in nomad systems. Elan's objectives were achieved with Atmel's ULC and stacked EEPROM (AT28C16) housed in the same CTBGA64 package (8 x 8 mm). The CTBGA64 accommodated the initial FPGA TQFP100 (14 x 14 mm) and an external EEPROM TSSOP24 (8 x 14 mm), thus saving approximately 80% board area.

Atmel thoroughly investigated several packaging with multiple dice in a single package. Finally, the CTBGA proved to be the most cost-effective solution with a thickness of only 1.1 mm in total.

"Thanks to Atmel's technology, Elan now claims to have the smallest, lowest power, highest performance integrated PCMCIA/CF serial interface chip available in the market today," said Julian Barnard, Elan's Managing Director. "Current demand suggests that this new Elan device will quickly establish itself as the industry standard, and Elan has plans for a family of products to be released in 2003."

"The introduction of these new stacked die devices will dramatically improve the Atmel FPGA/ULC conversion offering," said Manish Vadher, Marketing Director. "Embedded in the final application, Atmel ULCs offer an opportunity to quickly and easily reduce manufacturing costs and save space on the PC Board."

About Atmel

Founded in 1984, Atmel Corporation is headquartered in San Jose, Calif. with manufacturing facilities in North America and Europe. Atmel designs, manufactures and markets worldwide, advanced logic, mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also a leading provider of system-level integration semiconductor ICs using CMOS, BiCMOS, SiGe, and high-voltage BCDMOS process technologies.

About Elan

Founded in 1976 with headquarters in Fareham, Hampshire in the UK, Elan creates and designs innovative ICs for the high speed serial interface market. Their recently formed Mobile Information Systems Division focuses on products for the volume interface markets such as PDAs and mobile phones.

Atmel, the Atmel logo and combinations thereof are registered trademarks and others contained herein, are trademarks of Atmel Corporation. ChipArray is a registered trademark of Amkor Electronics Inc. Terms and product names in this document may be the trademarks of others.

Information

Further information about Atmel's ULC products may be retrieved at www.atmel.com/products/ulc

For product information Elan's website address is www.elandigitalsystems.com and enquiries can be made via e-mail to info@elandigitalsystems.com

CONTACT: Atmel
             Philippe Faure, +33 2 40 18 18 87 
             (Marketing Communications Manager)
             philippe.faure@nto.atmel.com
             Veronique Sablereau, +33 1 30 60 70 68
             (Corporate Communications Manager - Europe) 
             veronique.sablereau@atmel.com
             Clive Over, 408/451-2855 
             (Director of Press Relations - USA and Asia)
             cliveover@atmel.com
              or
             Elan
             Corinne Hadingham, +44 (0)1489 550202
             (Publicity Officer) 
             corinne.hadingham@elandigitalsystems.com